Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook (2025–2030)

The global semiconductor wafer polishing and grinding equipment market is on a steady growth path, projected to reach USD 2,921.3 million by 2025 and expand at a CAGR of 4.7% to hit USD 3,669.3 million by 2030. This growth is largely propelled by the rising demand for high-performance integrated circuits across applications such as smartphones, tablets, wearables, and other consumer electronics. These devices require extremely precise wafer finishing to support miniaturized and efficient chip designs, making advanced polishing and grinding equipment indispensable to the semiconductor value chain.

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The rapid advancement of technologies such as 5G, artificial intelligence (AI), and the Internet of Things (IoT) is further accelerating the need for refined semiconductor wafers. Additionally, increasing deployment of autonomous vehicles, high-performance computing infrastructure, and next-gen data centers has intensified the demand for ultra-flat and defect-free wafers, boosting investment in precision grinding and polishing tools.

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Wafer Size Analysis

The 300 mm wafer segment dominated with a 61.7% share in 2024. This segment benefits from economies of scale, allowing more chips to be produced per wafer, which reduces per-unit costs and increases fab productivity. The 300 mm format is the industry standard for cutting-edge semiconductor production.

Meanwhile, the 200 mm segment continues to serve legacy applications and specific device categories. Smaller wafer sizes (150 mm and below) remain relevant for specialty semiconductor applications and research fabs, though their market share is steadily declining.

Product Insights

The polishing machine segment led the global market with a 64.6% revenue share in 2024. Increasing demands for ultra-smooth wafer surfaces and tight dimensional tolerances in advanced nodes are key contributors. Double-side polishing machines are particularly favored for their efficiency in volume manufacturing.

Grinding machines are also gaining ground, driven by the growing importance of wafer thinning in packaging and interconnect processes. These machines play a critical role in improving surface planarity and preparing wafers for post-processing, especially in the production of memory and logic chips.

Market Drivers, Challenges, and Opportunities

Growth Drivers

• Surging demand for advanced semiconductors in consumer electronics, automotive electronics, and AI-enabled systems.

• Expansion of cloud computing and hyperscale data centers requiring higher-performance chips.

• Rapid development of 5G infrastructure and smart connected devices.

Opportunities

• Rising demand for wafer-level packaging and 3D ICs fuels the need for high-precision surface processing.

• Growing interest in sustainable manufacturing is driving demand for energy-efficient and low-waste equipment.

• Government-backed initiatives in regions like Asia Pacific and Europe aimed at boosting domestic semiconductor production offer avenues for equipment suppliers.